MECHANICAL PROCESSING OF SILICON SUBSTRATE, SURFACE CLEANING WITH ABRASIVE MATERIALS

Authors

  • Khabib Shukurullayevich Abdullayev Teacher at Chirchik State Pedagogical University

Keywords:

Semiconductor devices, integrated circuits, local diffusion, thermoelectric properties of porous SiNWs, silicon substrate, silicon oxide, doping, polishing, oxidation, photolithography, p-n junctions.

Abstract

This paper explores the processing of silicon substrates in microelectronics, specifically mechanical processing, polishing, oxidation, and other treatments, as well as the theoretical modeling of the thermoelectric properties of porous SiNWs.

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Published

2024-09-30

Issue

Vol. 2 No. 9 (2024): WOT

Section

Articles

License

Creative Commons License

This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

How to Cite

MECHANICAL PROCESSING OF SILICON SUBSTRATE, SURFACE CLEANING WITH ABRASIVE MATERIALS. (2024). Web of Technology: Multidimensional Research Journal, 2(9), 102-108. https://webofjournals.com/index.php/4/article/view/2193