MECHANICAL PROCESSING OF SILICON SUBSTRATE, SURFACE CLEANING WITH ABRASIVE MATERIALS

Khabib Shukurullayevich Abdullayev

MECHANICAL PROCESSING OF SILICON SUBSTRATE, SURFACE CLEANING WITH ABRASIVE MATERIALS

Authors

Khabib Shukurullayevich Abdullayev Teacher at Chirchik State Pedagogical University

Keywords:

Semiconductor devices, integrated circuits, local diffusion, thermoelectric properties of porous SiNWs, silicon substrate, silicon oxide, doping, polishing, oxidation, photolithography, p-n junctions.

Abstract

This paper explores the processing of silicon substrates in microelectronics, specifically mechanical processing, polishing, oxidation, and other treatments, as well as the theoretical modeling of the thermoelectric properties of porous SiNWs.

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Published

2024-09-30

How to Cite

Khabib Shukurullayevich Abdullayev. (2024). MECHANICAL PROCESSING OF SILICON SUBSTRATE, SURFACE CLEANING WITH ABRASIVE MATERIALS. Web of Technology: Multidimensional Research Journal, 2(9), 102–108. Retrieved from https://webofjournals.com/index.php/4/article/view/2193